The chemical etching process generally involves the following steps:
1. Cleaning: The substrate is thoroughly cleaned to remove any contaminants that could interfere with the etching process. 2. Masking: A resist material is applied to the substrate to protect areas that should not be etched. 3. Etching: The substrate is exposed to a chemical etchant, which selectively removes material from unprotected areas. 4. Rinsing: After etching, the substrate is rinsed to remove residual etchant and etched material. 5. Stripping: The resist material is removed, leaving the etched pattern on the substrate.
