Several factors contribute to film stress in catalytic materials:
Deposition Techniques: Methods like sputtering, chemical vapor deposition (CVD), and physical vapor deposition (PVD) can introduce varying levels of stress based on process parameters. Thermal Expansion: Differences in thermal expansion coefficients between the film and substrate can cause stress during temperature fluctuations. Intrinsic Properties: The inherent properties of the materials, such as crystal structure and defect density, also play a significant role.
