Plasma etching can be broadly classified into three types: - Reactive Ion Etching (RIE): Combines chemical and physical etching by using both reactive gases and ion bombardment. - Inductively Coupled Plasma (ICP) Etching: Utilizes a high-density plasma to achieve high etch rates and anisotropy. - Deep Reactive Ion Etching (DRIE): Specialized for creating deep, high-aspect-ratio features in substrates.
